The **ATS-P2-140-C3-R0** is a specific electronic component within the category of **Thermal Management**. It is a high-performance heat sink designed by Advanced Thermal Solutions (ATS). ### 1. General Specifications This part is a member of the **maxiFLOW™** family, characterized by its "flared" fin design which increases surface area for maximum heat dissipation in forced air environments. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-P2-140-C3-R0 | | **Component Type** | Heat Sink | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ | | **Fin Style** | Flared (maxiFLOW) | | **Thermal Resistance** | 7.30°C/W (at 200 LFM) | --- ### 2. Physical Dimensions The dimensions are critical for PCB layout and ensuring there is no mechanical interference with surrounding components. * **Length (A):** 37.00 mm * **Width (B):** 41.00 mm * **Height (C):** 14.50 mm (Low profile) * **Pitch (E):** 41.00 mm * **Pitch (F):** 37.00 mm --- ### 3. Electronic & Thermal Significance In an electronic circuit, this part serves the following functions: * **Heat Dissipation:** It is designed to sit atop high-heat components such as CPUs, GPUs, FPGAs, or Power MOSFETs. * **Thermal Interface Material (TIM):** The "R0" suffix usually indicates that the part comes with a pre-applied Thermal Interface Material (specifically **T412**), which is a high-performance thermal tape or pad used to bond the heat sink to the chip. * **Airflow Optimization:** The flared fin design reduces pressure drop across the heat sink, allowing air to move through more efficiently compared to standard straight-fin designs. --- ### 4. Mounting Mechanism: pushPIN™ This part uses a specific mechanical attachment system: 1. **Spring-Loaded Pins:** Provides consistent pressure to ensure the best thermal contact. 2. **Hardware:** It typically uses brass or plastic pins with stainless steel springs. 3. **Reliability:** This method is preferred over adhesives in high-vibration environments as it provides a secure, semi-permanent attachment.