The **ATS-P2-135-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 3.00°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 70mm x 70mm x 20mm | | **Fin Pattern** | Straight Fin | --- ### 2. Key Design Elements #### A. The pushPIN™ Attachment System One of the defining electronic integration features of this part is the **pushPIN™** system. Unlike adhesive-based heat sinks, this uses: * **Compression Springs:** Provides precise pressure (Force) to ensure maximum contact between the chip and the heat sink. * **Brass/Plastic Pins:** Used to secure the sink through pre-drilled holes in the PCB. #### B. Material and Coating * **Aluminum Construction:** Offers a balance between weight and thermal conductivity. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization process increases the surface emissivity, slightly improving heat radiation and protecting the aluminum from corrosion in industrial environments. #### C. Fin Geometry (Straight Fin) The straight-fin design is optimized for **forced air cooling**. It allows air from a system fan to flow through the channels with low pressure drop, making it ideal for server racks or high-airflow enclosures. --- ### 3. Thermal Performance Indicators In electronics, thermal management is measured by **Thermal Resistance (Θca)**. The ATS-P2-135-C2-R0 performs differently based on the Airflow (LFM - Linear Feet per Minute): * **Unducted Flow (200 LFM):** ~3.00°C/W * **Unducted Flow (500 LFM):** ~1.40°C/W * **Unducted Flow (700 LFM):** ~1.10°C/W *Note: A lower °C/W value indicates better cooling efficiency.* --- ### 4. Implementation Example If you are using this part for a power MOSFET generating **20W** of heat: 1. **Thermal Rise:** At 200 LFM (3.00°C/W), the temperature of the component will rise **60°C** above the ambient air temperature. 2. **Calculation:** $20W \times 3.00^\circ C/W = 60^\circ C$. ---