The **ATS-P2-134-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the primary mechanical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 70mm x 70mm x 15mm | | **Thermal Resistance** | 4.48°C/W (at 200 LFM) | | **Flow Pattern** | maxiFLOW (Tapered Fin Design) | | **Thermal Interface Material (TIM)** | T412 (Phase Change Material) | --- ### 2. Key Electronic & Mechanical Features #### A. The maxiFLOW™ Fin Geometry The "C3" in the part number refers to the specific fin configuration. The fins are tapered and angled to maximize surface area while reducing pressure drop. This is critical in electronics because it allows air to flow more efficiently through the heat sink, even in high-density PCB layouts. #### B. pushPIN™ Attachment System This part uses a specific mounting mechanism: * **Compression Springs:** Provides precise pressure (pre-assembled) to ensure optimal contact with the electronic component. * **Plastic/Brass Bushings:** Ensures the pins do not damage the PCB during installation or high-vibration environments. #### C. Thermal Interface Material (T412) The unit comes pre-applied with **T412**, which is a high-performance thermal pad/grease substitute. In electronics, this is the "bridge" that fills microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal impedance. --- ### 3. Typical Applications The ATS-P2-134-C3-R0 is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling high-speed switching equipment. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Supplies:** Dissipating heat from MOSFETs or IGBT modules. 4. **Networking:** High-end routers and server blades. ---