The **ATS-P2-130-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *maxiFLOW™* series manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its specifications, electronic application, and technical features. --- ### 1. General Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-P2-130-C3-R0 | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 5.28°C/W (at 100 LFM) | | **Weight** | 13.5 grams | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring no interference with surrounding electronic components. * **Length:** 30.00 mm * **Width:** 30.00 mm * **Height:** 15.00 mm * **Pitch (Fin spacing):** Designed for high-density airflow. --- ### 3. Key Electronic Components & Technologies #### A. The pushPIN™ Attachment System Unlike adhesive tapes that can fail under high heat, this part uses the **pushPIN™** system. This involves: * **Steel Springs:** Provide precise pressure (compression) to the electronic chip (CPU/GPU/FPGA) to ensure maximum contact with the thermal interface material. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB. #### B. maxiFLOW™ Fin Design The electronic performance of this part is enhanced by its "flared fin" geometry. In electronic enclosures where airflow is constrained, the flared fins increase the surface area and reduce the pressure drop, allowing heat to dissipate faster even at lower fan speeds. #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates the pre-applied **T766** thermal phase-change material. This is an electronic-grade coating that fills microscopic air gaps between the heat sink and the component, significantly lowering thermal impedance. --- ### 4. Ideal Applications This component is designed to protect sensitive electronic parts from "thermal throttling" or hardware failure. It is typically used for: * **Voltage Regulators (VRMs):** Managing heat in power delivery circuits. * **FPGAs & ASICs:** Cooling high-speed logic chips in networking gear. * **Embedded Systems:** Industrial PCs where space is limited but heat generation is high. ---