The **ATS-P2-126-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.66°C/W (at 200 LFM) | | **Flow Direction** | Directional (High-performance fin pattern) | --- ### 2. Key Design Features #### A. Fin Geometry The "P2" in the part number refers to the **maxiFLOW™** design. Unlike standard straight-fin heat sinks, this design features a tapered fin structure that: * Reduces pressure drop. * Increases surface area for convection. * Maximizes airflow through the fin field, which is critical in dense electronic enclosures. #### B. pushPIN™ Attachment This part utilizes a **pushPIN™** mounting system. * It consists of a brass or plastic pin and a high-performance compression spring. * It ensures a precise, repeatable "clip-on" force to maintain optimal contact between the heat sink and the electronic component (TIM - Thermal Interface Material). #### C. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodizing:** This is not just aesthetic; the anodized layer provides corrosion resistance and improves thermal emissivity. --- ### 3. Application Use Cases This specific heat sink is typically found in the following electronic systems: 1. **Telecommunications:** High-speed routers and switches where components generate significant heat in tight spaces. 2. **Industrial PC (IPC):** Embedded systems requiring passive or active cooling for processing units. 3. **Power Electronics:** Cooling MOSFETs or IGBT modules that are mounted directly to a PCB. --- ### 4. Part Number Breakdown The nomenclature `ATS-P2-126-C2-R0` can be decoded as follows: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **P2:** Product Family (maxiFLOW™). * **126:** Specific size/footprint code. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or Packaging variant.