## Technical Overview: ATS-P2-124-C1-R0 The **ATS-P2-124-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for high-density electronic cooling applications such as networking equipment, power supplies, and processors. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body) / Copper (Interface) | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Heat Sink Type** | Straight Fin | | **Dimensions (LxWxH)** | 50.00mm x 50.00mm x 25.00mm | | **Thermal Resistance** | 1.18 °C/W (at 200 LFM) | | **Finish** | Blue Anodized | | **Interface Material** | T766 (High Performance Phase Change) | --- ### 2. Physical Design Elements * **Fin Geometry:** It features a **Straight Fin** design. This is optimized for high-velocity airflow environments where the air can move through the fins with minimal resistance. * **Base Plate:** The base is flat and polished to ensure maximum surface contact with the heat-generating component (CPU/GPU/FPGA). * **Push-Pin Mechanism:** The "P2" in the part number indicates the specific spring-loaded push-pin attachment. This provides a consistent, pre-determined pressure on the component, improving thermal transfer and mechanical stability during vibration. --- ### 3. Electronic Application & Usage The ATS-P2-124-C1-R0 is typically used for the following electronic cooling needs: 1. **Passive Cooling:** Used in systems with existing system-level fans (forced convection). 2. **High-Power Semiconductor Cooling:** Ideal for components with a High Thermal Design Power (TDP) between 30W and 70W, depending on ambient airflow. 3. **Telecom & Networking:** Used on ASICs (Application-Specific Integrated Circuits) within routers and switches. --- ### 4. Thermal Performance Comparison | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.02 | | 200 (1.0 m/s) | 1.18 | | 300 (1.5 m/s) | 0.94 | | 400 (2.0 m/s) | 0.81 | ---