ATS-P2-123-C2-R0
AI

The **ATS-P2-123-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series and is designed for cooling electronic components such as CPUs, GPUs, and high-power chipsets.
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## 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Fin Type** | Fine-Pitch (Vertical fins) |
| **Dimensions** | 45mm x 45mm x 20mm |
| **Attachment Method** | pushPIN™ (Brass Push Pins) |
| **Spring Type** | Compression Spring (Blue) |
| **Thermal Resistance** | 4.16 °C/W (Unducted Flow @ 200 LFM) |
| **Finish** | Blue Anodized |
| **Thermal Interface** | T766 (Pre-applied Phase Change Material) |
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## 2. Component Breakdown
### A. Material and Coating
The part is fabricated from **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish provides a layer of corrosion resistance and electrical insulation, while slightly increasing surface emissivity for better radiant heat transfer.
### B. Attachment Mechanism (pushPIN™)
Unlike adhesive-based heat sinks, this part uses a mechanical fastening system:
- **Push Pins:** Brass pins with a flexible barb that locks into pre-drilled holes on the PCB.
- **Compression Springs:** Provides consistent pressure on the component, ensuring the Thermal Interface Material (TIM) fills microscopic gaps between the chip and the heat sink.
### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates the presence of **T766 thermal grease/film**. This is pre-applied to the base, simplifying assembly and ensuring optimal heat transfer from the electronic component to the aluminum fins.
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## 3. Part Number Decoder
Understanding the naming convention helps in identifying the specific electronic application:
| Segment | Meaning | Detail |
| :--- | :--- | :--- |
| **ATS** | Manufacturer | Advanced Thermal Solutions |
| **P2** | Attachment Type | pushPIN™ Series |
| **123** | Product Family | Designates base size and fin configuration |
| **C2** | Thermal Material | T766 Phase Change Material |
| **R0** | Revision/Finish | Revision 0, Blue Anodized |
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## 4. Typical Applications
This component is found in various electronic sectors:
1. **Networking Hardware:** High-speed routers and switches.
2. **Industrial Computing:** Embedded systems that require reliable vibration-resistant mounting.
3. **Power Supplies:** Cooling MOSFETs or power ICs.
4. **Automotive Electronics:** Sensors and control units where thermal stability is critical.
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What are the PCB hole diameter requirements for the pushPIN attachment?
- ⤷ How does the T766 thermal material compare to standard silicone grease?
- ⤷ Can this heat sink be used in a passive (no fan) cooling environment?