The **ATS-P2-12-C1-R0** is a high-performance thermal management component, specifically a **Heat Sink** from Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the part: | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | pushPIN™ Series | | **Material** | Aluminum | Blue Anodized Finish | | **Base Dimensions** | 50.00mm x 50.00mm | Square profile | | **Height** | 12.70mm | Low profile design | | **Fin Type** | XCUT | Cross-cut for omnidirectional airflow | | **Attachment** | Push-Pin | Spring-loaded mounting system | | **Thermal Resistance** | 15.84 °C/W (Unducted) | At 100 LFM (Linear Feet per Minute) | | **TIM** | T766 | Pre-applied Thermal Interface Material | --- ### 2. Design Features * **XCUT Fin Pattern:** Unlike straight-fin heat sinks, the XCUT pattern uses a grid-like cross-cut design. This is ideal for systems where the airflow direction is inconsistent or restricted, as it allows air to enter and exit from multiple angles. * **Push-Pin Attachment:** The part uses a "Push-Pin" mechanism with a brass or plastic pin and a high-performance compression spring. This ensures consistent pressure (clamping force) against the electronic component, which is vital for efficient heat transfer. * **Low Profile:** At only 12.7mm tall, this heat sink is designed for space-constrained environments such as 1U servers, telecommunications equipment, or compact embedded systems. --- ### 3. Electronic Application The ATS-P2-12-C1-R0 is typically used on the following electronic components: 1. **ASICs & FPGAs:** High-speed logic chips that generate localized heat. 2. **Power Supplies:** Cooling MOSFETs or power regulators. 3. **Network Switch Chips:** Ensuring the main processor of a router or switch stays within operating temperatures. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air moving through the system: | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 15.84 | 6.29 | 3.46 | 2.49 | 2.01 |