The **ATS-P2-118-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-P2-118-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 6.54 °C/W (Unducted Flow @ 1.0 m/s) | | **Fin Pattern** | Fine Pitch (straight fins) | --- ### Key Electronic & Mechanical Characteristics #### 1. Thermal Dissipation Performance This heat sink is categorized under the "XC" (Extra Coarse) or "Fine" pitch family depending on the air velocity. At a standard airflow of 200 LFM (Linear Feet per Minute), its thermal resistance is approximately **3.38 °C/W**. This means for every watt of power the electronic part generates, the temperature of the junction will rise by 3.38 degrees Celsius above the ambient air temperature. #### 2. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "P2" in the part number indicates it uses the **pushPIN™** system. This provides: * **Constant Pressure:** A brass or plastic pin with a high-performance spring ensures even pressure across the component for better thermal interface contact. * **Reliability:** It is more secure than thermal tape in high-vibration environments. * **Reusability:** The part can be removed and re-installed during PCB repairs. #### 3. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization layer provides electrical insulation (to prevent shorting if the sink touches a live trace) and improves radiant heat transfer. --- ### Application Use Cases This specific model is typically found in: * **Telecommunications:** Cooling of high-speed network switches. * **Embedded Systems:** Industrial PCs where space is limited (15mm height profile). * **Power Electronics:** Cooling MOSFET arrays or Voltage Regulator Modules (VRMs).