The **ATS-P2-117-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" series. Below is a breakdown of its technical specifications and electronic application characteristics. --- ### 1. Technical Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | XC Cut (Cross-cut) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.33°C/W (@ 100 LFM) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits on a Printed Circuit Board (PCB) without interfering with adjacent components. * **Length (Dimension A):** 45.00 mm * **Width (Dimension B):** 45.00 mm * **Height (Dimension C):** 10.00 mm (Low profile) * **Pitch (Dimension E):** 38.00 mm (Distance between mounting holes) --- ### 3. Electronic Design Characteristics #### A. Thermal Performance This heat sink is designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. The "XC Cut" design provides a "cross-cut" fin pattern, which allows for multi-directional airflow. This makes it highly efficient in systems where air might be coming from different angles or in compact enclosures. #### B. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the **ATS-P2-117-C3-R0** uses a mechanical push-pin system. * **Reliability:** Provides constant pressure (preload) for better thermal interface material (TIM) performance. * **Durability:** More secure than tape in high-vibration or high-heat environments. * **Installation:** Requires pre-drilled holes in the PCB. #### C. Material & Finish * **Aluminum:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodize:** This is not just for aesthetics; the anodized coating increases the surface emissivity, slightly improving radiative cooling, and protects the aluminum from corrosion. --- ### 4. Application Context In electronic engineering, this part is typically used for: 1. **Telecommunications Equipment:** Where high reliability and low profile are required. 2. **Embedded Systems:** Cooling processors on compact boards. 3. **Power Supplies:** Managing heat on power-regulating transistors.