The **ATS-P2-08-C1-R0** is a specific electronic component, specifically a **high-performance heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, and high-power chipsets. --- ### Technical Specifications The following table summarizes the key physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 14.57°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 15.00mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | ATS-51 (Pre-applied) | --- ### Electronic and Mechanical Components The "parts" of this assembly work together to manage the thermal profile of a PCB: 1. **The Heat Sink Body:** * **Geometry:** Features a square footprint with vertical fins. * **Heat Dissipation:** The aluminum fins increase the surface area, allowing heat to transfer from the component (heat source) to the surrounding air. 2. **The Attachment System (Push-Pins):** * The "P2" in the part number indicates a specific push-pin type. * These are spring-loaded mechanical fasteners that pass through pre-drilled holes in the PCB. They ensure constant downward pressure, which is critical for maximizing thermal conductivity. 3. **Thermal Interface Material (TIM):** * The "C1" indicates the type of thermal compound pre-applied to the base. * The TIM fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance. --- ### Part Number Breakdown (Nomenclature) Understanding the code helps in identifying the specific configuration: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **P2:** Push-pin type/configuration. * **08:** Designates the specific fin pattern/series. * **C1:** Thermal Interface Material (TIM) code. * **R0:** Revision code (standard version). ### Application Use Cases * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Cooling of networking processors. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators.