The **ATS-P2-02-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "push-pin" series designed for cooling surface-mount components like CPUs, GPUs, or FPGAs. --- ## 🛠️ Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with Compression Springs) | | **Thermal Resistance** | 18.44°C/W (Unducted @ 200 LFM) | | **Dimensions** | 40mm x 40mm x 10mm | | **Weight** | 10.0 grams | --- ## 🧩 Key Components & Features ### 1. Fin Profile (Straight Fin) The "P2" in the part number indicates the fin structure. This model uses a **Straight Fin** design. * **Purpose:** Provides maximum surface area for heat dissipation in environments with consistent airflow. * **Efficiency:** Ideal for high-velocity air cooling. ### 2. Push-Pin Attachment Mechanism Instead of using adhesive tapes or thermal epoxy, this part uses a mechanical fastening system: * **Push-Pins:** Plastic or brass pins that lock into pre-drilled holes on the PCB. * **Compression Springs:** These ensure constant, high pressure between the heat sink and the electronic component, which significantly improves thermal transfer. ### 3. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides increased corrosion resistance and slightly improves "emissivity" (the ability to radiate heat). ### 4. Thermal Interface Material (TIM) The "C3" suffix typically indicates that the part comes pre-applied with a thermal interface material (like a Phase Change Material or thermal pad). * **Function:** Fills microscopic air gaps between the heat sink and the chip to reduce thermal resistance. --- ## 📈 Performance Data (Airflow) | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 18.44 | | 400 (2.0 m/s) | 8.82 | | 600 (3.0 m/s) | 6.39 | | 800 (4.0 m/s) | 5.17 | --- ## ⚠️ Application Notes This part is best suited for **Electronic Power Applications** where reliability is critical. Because it uses mechanical push-pins, it is more resistant to shock and vibration than "peel-and-stick" heat sinks, making it ideal for telecommunications, automotive, and industrial computing.