ATS-P1-91-C2-R0
AI

The **ATS-P1-91-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum (with Blue Anodized Finish) |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 6.85° C/W @ 100 LFM (Linear Feet per Minute) |
| **Dimensions** | 40mm x 40mm x 10mm |
| **Fin Pattern** | Straight / Square Pin |
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### 2. Design and Engineering Features
* **maxiFLOW™ Geometry:** The heat sink features a high-aspect-ratio fin design that maximizes surface area while minimizing pressure drop. This allows more air to flow through the device, significantly increasing cooling efficiency.
* **pushPIN™ Attachment:** This model uses a plastic push-pin mechanism with a built-in compression spring. This ensures a secure, high-pressure fit against the electronic component for optimal heat transfer without requiring complex mounting hardware.
* **Interface Material (TIM):** This specific part number (R0) usually comes pre-applied with a high-performance **Thermal Interface Material** (like T766 or similar phase-change material), ensuring no air gaps exist between the chip and the heat sink.
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### 3. Application Use Cases
The ATS-P1-91-C2-R0 is typically used in environments where space is limited but thermal loads are high:
1. **Telecommunications:** Cooling of networking switches and routers.
2. **Embedded Systems:** For industrial PCs or high-speed controllers.
3. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power conversion modules.
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### 4. Thermal Performance Data
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 6.85 |
| 200 (1.0 m/s) | 4.02 |
| 400 (2.0 m/s) | 2.59 |
| 600 (3.0 m/s) | 2.01 |
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- ⤷
What is the difference between the C2 and C1 material variants in ATS heat sinks?
- ⤷ How do I calculate the required LFM for my specific electronic component?
- ⤷ Are there alternative mounting options if pushPIN is not compatible with my PCB?