ATS-P1-90-C2-R0
AI

The **ATS-P1-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product series, designed to provide efficient cooling for high-power electronic devices.
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### 1. Technical Specifications
Below are the primary electronic and mechanical specifications for this part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Anodized Blue) |
| **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 25.00mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 6.33°C/W (at 200 LFM) |
| **Flow Direction** | Rectangular fins for unidirectional airflow |
| **Compliance** | RoHS Compliant |
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### 2. Core Components and Design
The ATS-P1-90-C2-R0 is engineered with several key structural features that define its performance:
* **Finned Geometry:** It uses a high-aspect-ratio fin design which maximizes the surface area available for heat dissipation while maintaining a low profile.
* **Thermal Interface Material (TIM):** This part usually comes pre-applied with high-performance phase-change material or thermal grease (T766) to ensure low contact resistance between the electronic component (like a BGA chip) and the heat sink.
* **pushPIN™ Attachment:** The "P1" in the part number refers to the specific push-pin and spring mechanism. This ensures constant, uniform pressure on the component, which is critical for maintaining thermal efficiency over the product's lifespan.
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### 3. Application Use Cases
This part is typically found in environments where heat dissipation is critical for electronic longevity:
1. **Networking Hardware:** Switches, routers, and high-speed hubs.
2. **Power Electronics:** Voltage regulators and power modules that generate significant localized heat.
3. **Embedded Systems:** Industrial PCs and FPGA-based controllers where space is limited but thermal output is high.
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### 4. Part Number Breakdown
The naming convention follows a specific logic:
```text
ATS - P1 - 90 - C2 - R0
| | | | |
| | | | +-- Revision Code
| | | +------- Material/Finish (Anodized Blue)
| | +------------ Height/Design Profile
| +----------------- Attachment Style (pushPIN™)
+---------------------- Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What is the thermal resistance of this part at different airflow speeds?
- ⤷ What are the specific hole patterns required for the pushPIN mounting?
- ⤷ Does this heat sink come with pre-applied Thermal Interface Material (TIM)?