The **ATS-P1-84-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink** from Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, FPGAs, or power modules. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (2-Pin) | | **Thermal Resistance** | 7.00°C/W (Unducted Flow @ 200 LFM) | | **Dimensions** | 30mm x 30mm | | **Height** | 25mm | | **Finish** | Blue Anodized | --- ### 2. Key Features The "ATS-P1-84-C2-R0" utilizes specific design philosophies to maximize efficiency in cramped electronic enclosures: * **Straight Fin Design:** Provides a large surface area for heat transfer. It is most effective when there is a consistent directional airflow (forced convection). * **Push-Pin Mounting:** Uses a spring-loaded brass or plastic pin mechanism. This ensures constant pressure on the electronic component, which improves the thermal interface and prevents the sink from shifting during vibration. * **C2 Material/Finish:** The "C2" code refers to the material and finish. It is high-quality aluminum with a blue anodized coating, which provides corrosion resistance and increased emissivity. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **ATS-PPS-01** (or similar), a high-performance thermal pad that fills microscopic air gaps between the chip and the heat sink. --- ### 3. Application Use Cases This heat sink is common in industrial and telecommunications hardware: 1. **Embedded Computing:** Cooling processors on small-form-factor motherboards. 2. **Network Switches:** Regulating temperatures of ASIC controllers. 3. **Power Supplies:** Dissipating heat from high-speed switching transistors. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 12.00 | | 300 (1.5 m/s) | 5.50 | | 500 (2.5 m/s) | 4.30 |