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  • ATS-P1-76-C3-R0

  • AI
    The **ATS-P1-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and high-power semiconductors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Length** | 25.00 mm | | **Width** | 25.00 mm | | **Height (Fin)** | 10.00 mm | | **Thermal Resistance** | 27.33 °C/W (Unducted Flow @ 100 LFM) | | **Airflow Direction** | Vertical/Horizontal | --- ### 2. Design Features The "electronic" functionality of this part is passive, meaning it does not use electricity but is critical for the survival of electronic circuits. * **maxiFLOW™ Geometry:** The fins feature a unique "flared" design. This increases the surface area and creates turbulence, which allows for better heat dissipation in restricted airflow environments. * **pushPIN™ Attachment:** The "R0" suffix refers to the mounting system. It uses a high-tension spring and a plastic pin that locks into pre-drilled holes on the Printed Circuit Board (PCB), ensuring constant pressure on the electronic chip. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied **Phase Change Material** or thermal tape to bridge the microscopic air gaps between the chip and the aluminum base. --- ### 3. Applications in Electronics This component is used to manage the "Thermal Design Power" (TDP) of various small-form-factor devices: 1. **Network Switches:** Cooling ASICs and high-speed processing chips. 2. **Embedded Systems:** For industrial computers where space is limited but heat density is high. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **P1:** Part of the pushPIN™ series * **76:** Specific die/dimension code * **C3:** Material/Finish code (Blue Anodized) * **R0:** Revision/Packaging code
    ✨ Follow-up Questions
    • ⤷ What are the alternative mounting methods for ATS heat sinks?
    • ⤷ How do I calculate if the 27.33 °C/W thermal resistance is sufficient for my chip?
    • ⤷ Does this heat sink come with pre-applied thermal grease?