ATS-P1-76-C3-R0
AI

The **ATS-P1-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and high-power semiconductors.
---
### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Series** | maxiFLOW™ |
| **Attachment Method** | pushPIN™ |
| **Length** | 25.00 mm |
| **Width** | 25.00 mm |
| **Height (Fin)** | 10.00 mm |
| **Thermal Resistance** | 27.33 °C/W (Unducted Flow @ 100 LFM) |
| **Airflow Direction** | Vertical/Horizontal |
---
### 2. Design Features
The "electronic" functionality of this part is passive, meaning it does not use electricity but is critical for the survival of electronic circuits.
* **maxiFLOW™ Geometry:** The fins feature a unique "flared" design. This increases the surface area and creates turbulence, which allows for better heat dissipation in restricted airflow environments.
* **pushPIN™ Attachment:** The "R0" suffix refers to the mounting system. It uses a high-tension spring and a plastic pin that locks into pre-drilled holes on the Printed Circuit Board (PCB), ensuring constant pressure on the electronic chip.
* **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied **Phase Change Material** or thermal tape to bridge the microscopic air gaps between the chip and the aluminum base.
---
### 3. Applications in Electronics
This component is used to manage the "Thermal Design Power" (TDP) of various small-form-factor devices:
1. **Network Switches:** Cooling ASICs and high-speed processing chips.
2. **Embedded Systems:** For industrial computers where space is limited but heat density is high.
3. **Power Supplies:** Cooling MOSFETs or voltage regulators.
---
### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **P1:** Part of the pushPIN™ series
* **76:** Specific die/dimension code
* **C3:** Material/Finish code (Blue Anodized)
* **R0:** Revision/Packaging code
- ⤷
What are the alternative mounting methods for ATS heat sinks?
- ⤷ How do I calculate if the 27.33 °C/W thermal resistance is sufficient for my chip?
- ⤷ Does this heat sink come with pre-applied thermal grease?