## Technical Overview of ATS-P1-75-C1-R0 The **ATS-P1-75-C1-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment series, specifically designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Part Number** | ATS-P1-75-C1-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 1.47°C/W @ 200 LFM (Linear Feet per Minute) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | --- ### 2. Design and Construction #### A. Fin Profile (straight fin) The unit features a high-density straight-fin design. This increases the surface area available for heat dissipation, making it highly effective in environments with forced-air cooling (fans). #### B. Push-Pin Mounting Instead of using adhesive tapes or thermal epoxy, this model uses a **brass push-pin** mechanism. - **Reliability:** Provides consistent pressure (clamping force) across the component. - **Serviceability:** Allows for easier removal and re-application of thermal paste compared to permanent adhesives. #### C. Material and Coating - **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. - **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiant heat transfer. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how effectively the device moves heat away from the silicon die. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 1.95 | | 200 (1.0 m/s) | 1.47 | | 300 (1.5 m/s) | 1.25 | | 400 (2.0 m/s) | 1.12 | --- ### 4. Typical Applications * **BGA (Ball Grid Array) Cooling:** Used on chipsets, processors, and FPGAs. * **Telecommunications:** Network switches and routers. * **Industrial PCs:** Compact computing modules requiring passive or active cooling.