The **ATS-P1-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high-efficiency cooling for electronic components like CPUs, GPUs, and ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Thermal Resistance (LFM 200)** | 2.51 °C/W | | **Thermal Resistance (LFM 700)** | 0.82 °C/W | | **Spring Type** | ATS-PPS-01 | | **Interface Material** | T766 (Pre-applied Phase Change Material) | --- ### 2. Key Design Features * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that increases the surface area for maximum convection while minimizing the pressure drop. * **pushPIN™ Attachment:** This model uses a plastic or brass push-pin mechanism combined with a compression spring. This ensures consistent pressure on the electronic component, which optimizes heat transfer through the thermal interface material (TIM). * **High Performance:** It is optimized for "forced air" environments (airflow from fans). As shown in the specs, the thermal resistance drops significantly as airflow (LFM - Linear Feet per Minute) increases. * **Pre-applied TIM:** The "T766" designation indicates it comes with a high-performance phase-change material already applied to the base, simplifying the assembly process in manufacturing. --- ### 3. Application Use Cases This part is typically found in: * **Telecommunications:** Cooling of high-speed networking processors. * **Embedded Systems:** Thermal management for industrial motherboards. * **Power Electronics:** Dissipating heat from high-wattage voltage regulators. ---