The **ATS-P1-66-C2-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, specifically designed for cooling high-power semiconductors. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | maxiFLOW™ | | **Heat Sink Type** | Push-Pin / High Performance | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 35.00mm | | **Thermal Resistance** | 1.15°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Interface Material** | T766 (Thermal Tape) | --- ## 2. Key Design Components ### A. Fin Geometry (maxiFLOW™) The part features a unique **flared fin structure**. Unlike standard straight-fin heat sinks, the flared design increases the surface area for radiation and maximizes airflow intake, which is critical for components in constrained spaces with low-to-medium air velocity. ### B. Attachment Mechanism (Push-Pin) The "P1" in the part number indicates a specific push-pin configuration. * **Engagement:** Uses a spring-loaded mechanism to provide consistent pressure on the processor/chip. * **Reliability:** Ensures the thermal interface material (TIM) maintains optimal contact even under mechanical shock or vibration. ### C. Thermal Interface Material (TIM) The **C2** designation typically refers to the pre-applied thermal interface. In this case, it usually comes with **T766 phase-change material** or a high-performance thermal tape, ensuring low contact resistance between the electronic component and the aluminum base. --- ## 3. Applications This part is commonly found in the following electronic sectors: 1. **Telecommunications:** Cooling high-speed ASICs and FPGAs in routers and switches. 2. **Embedded Systems:** Industrial PCs where vertical clearance allows for a 35mm height. 3. **Data Centers:** Server motherboards requiring localized cooling for chipsets. ---