ATS-P1-61-C2-R0
AI

The **ATS-P1-61-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, and high-power chipsets.
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## 1. Technical Specifications
The following table outlines the physical and thermal properties of the part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Series** | pushPIN™ |
| **Base Material** | Aluminum (AL6063) |
| **Thermal Resistance** | 22.01°C/W (Unducted @ 100 LFM) |
| **Dimensions (L x W)** | 40.00 mm x 40.00 mm |
| **Height (Fin)** | 10.00 mm |
| **Attachment Method** | Push-Pin (Brass) |
| **Finish** | Blue Anodized |
| **Thermal Interface Material** | T766 (Pre-applied) |
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## 2. Key Component Features
### A. pushPIN™ Attachment System
This part uses a specific spring-loaded push-pin mechanism. This is critical for:
* **Constant Pressure:** Ensures the heat sink maintains firm contact with the electronic component.
* **Ease of Assembly:** Can be installed onto a PCB without specialized tools, provided the board has the required pre-drilled holes.
### B. Fin Design
The part features a **straight-fin** geometry. This design is optimized for environments where there is an existing airflow (forced convection), allowing heat to be carried away efficiently as air passes through the vertical channels.
### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates the use of **T766** thermal grease. This material is pre-applied to the base of the heat sink to fill microscopic air gaps between the chip and the aluminum base, significantly reducing thermal impedance.
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## 3. Physical Dimensions (mm)
| Dimension | Size |
| :--- | :--- |
| **Length (A)** | 40.00 mm |
| **Width (B)** | 40.00 mm |
| **Height (C)** | 10.00 mm |
| **Pitch (E)** | 33.00 mm |
| **Pitch (F)** | 33.00 mm |
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## 4. Part Number Decoder
Understanding the "ATS-P1-61-C2-R0" syntax:
* **ATS**: Advanced Thermal Solutions.
* **P1**: pushPIN™ series.
* **61**: Specific fin/size configuration.
* **C2**: Indicates T766 thermal interface material.
* **R0**: Revision/Packaging code.
- ⤷
What are the PCB hole requirements for the push-pin mounting on this heat sink?
- ⤷ How does the thermal resistance change at higher airflows (e.g.
- ⤷ 500 LFM)?
- ⤷ Is this heat sink compatible with standard 40mm cooling fans?