The **ATS-P1-55-C2-R0** is a high-performance electronic thermal management component, specifically an aluminum heat sink part of the **maxiFLOW™** series manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Unducted)** | 23.98 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 3.31 °C/W @ 200 LFM | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 10mm | | **Fine Pitch/Pattern** | Straight Fin (Square) | --- ### 2. Key Electronic Components & Design The ATS-P1-55-C2-R0 is engineered to protect sensitive integrated circuits (ICs) from thermal throttling or failure. #### A. Thermal Interface Material (TIM) * **Pre-Applied:** This specific model usually comes with **T766** thermal interface material. * **Function:** It fills microscopic air gaps between the heat sink base and the electronic component (CPU, GPU, or FPGA) to maximize heat transfer efficiency. #### B. pushPIN™ Attachment System * **Mechanical Integrity:** Unlike simple adhesive tapes, the pushPIN™ system uses a brass component and a stainless steel spring. * **Pressure Consistency:** This ensures uniform pressure across the electronic chip, which is critical for maintaining a reliable thermal connection in high-vibration environments. #### C. Airflow Optimization (maxiFLOW™) * The design features a **flared fin structure**. This increases the surface area for heat dissipation while maintaining a low pressure drop, making it ideal for high-density electronic enclosures where space is limited but cooling demands are high. --- ### 3. Application Use Cases This part is commonly found in the following electronic sectors: 1. **Telecommunications:** Cooling high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Dissipating heat from MOSFETs or power regulators.