The **ATS-P1-47-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs) and other electronic components to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the material, dimensions, and thermal properties. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 2.23°C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | --- ### 2. Physical Design & Features The "P1" designation refers to the specific **straight-fin** or **cross-cut** design optimized for airflow. * **Heat Sink Profile:** It features a tall 30mm profile, which provides a large surface area relative to its 25mm footprint, making it ideal for boards with vertical clearance. * **Push-Pin Attachment:** The "R0" at the end of the part number indicates the use of plastic push-pins and a compression spring. This ensures consistent pressure between the heat sink and the component (TIM - Thermal Interface Material). * **Material Properties:** Made from lightweight aluminum with high thermal conductivity. The Blue Anodized finish increases surface emissivity and provides corrosion resistance. --- ### 3. Thermal Performance (Flow Rate) Thermal resistance varies based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.23 | | 200 (1.0 m/s) | 1.72 | | 300 (1.5 m/s) | 1.51 | | 400 (2.0 m/s) | 1.38 | --- ### 4. Typical Applications This specific part is commonly found in: 1. **Networking Hardware:** Routers, switches, and small-form-factor servers. 2. **Power Electronics:** Voltage regulators and power transistors. 3. **Embedded Systems:** High-speed processors or FPGAs that generate significant heat in a small 25x25mm area.