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  • ATS-P1-39-C2-R0

  • AI
    The **ATS-P1-39-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product line, designed for high-density electronic cooling. --- ### 1. Technical Specifications Below are the primary technical parameters for the ATS-P1-39-C2-R0: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL-6063) | | **Finish** | Blue Anodized | | **Heat Sink Type** | maxiFLOW™ (Flared Fin) | | **Thermal Resistance** | 3.58°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 22.86mm | | **Weight** | ~40.5 grams | --- ### 2. Key Components and Design Features #### A. Flared Fin Geometry The "maxiFLOW" design features a flared fin structure. Unlike straight-fin heat sinks, the fins expand outward. This increases the surface area and maximizes air intake, reducing the pressure drop across the device. #### B. pushPIN™ Attachment The part uses a specialized attachment mechanism: - **Spring-loaded pins:** These provide a consistent, high-pressure force against the electronic component (CPU, FPGA, etc.). - **Stability:** It ensures better thermal interface material (TIM) contact and prevents shifting during vibration or transport. #### C. Thermal Performance The cooling efficiency depends on the Airflow Velocity (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 7.30 | | 200 | 3.58 | | 400 | 2.11 | | 600 | 1.62 | --- ### 3. Application Use Cases This part is typically found in high-performance electronic environments where space is limited but heat dissipation is critical: * **Networking Hardware:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Semiconductor Cooling:** Cooling for FPGAs, ASICs, and high-speed processors. --- ### 4. Part Number Breakdown The SKU `ATS-P1-39-C2-R0` can be decoded as follows: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **P1:** Product series (maxiFLOW). * **39:** Specific dimension/footprint code. * **C2:** Blue Anodized finish. * **R0:** Revision/Standard version.
    ✨ Follow-up Questions
    • ⤷What is the recommended Thermal Interface Material (TIM) for this heat sink?
    • ⤷ How do pushPIN mounting holes compare to adhesive-based mounting?
    • ⤷ What are the alternatives to blue anodized finishes in terms of thermal performance?