ATS-P1-39-C2-R0
AI

The **ATS-P1-39-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product line, designed for high-density electronic cooling.
---
### 1. Technical Specifications
Below are the primary technical parameters for the ATS-P1-39-C2-R0:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL-6063) |
| **Finish** | Blue Anodized |
| **Heat Sink Type** | maxiFLOW™ (Flared Fin) |
| **Thermal Resistance** | 3.58°C/W (at 200 LFM) |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 22.86mm |
| **Weight** | ~40.5 grams |
---
### 2. Key Components and Design Features
#### A. Flared Fin Geometry
The "maxiFLOW" design features a flared fin structure. Unlike straight-fin heat sinks, the fins expand outward. This increases the surface area and maximizes air intake, reducing the pressure drop across the device.
#### B. pushPIN™ Attachment
The part uses a specialized attachment mechanism:
- **Spring-loaded pins:** These provide a consistent, high-pressure force against the electronic component (CPU, FPGA, etc.).
- **Stability:** It ensures better thermal interface material (TIM) contact and prevents shifting during vibration or transport.
#### C. Thermal Performance
The cooling efficiency depends on the Airflow Velocity (LFM - Linear Feet per Minute):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 | 7.30 |
| 200 | 3.58 |
| 400 | 2.11 |
| 600 | 1.62 |
---
### 3. Application Use Cases
This part is typically found in high-performance electronic environments where space is limited but heat dissipation is critical:
* **Networking Hardware:** High-speed routers and switches.
* **Embedded Systems:** Industrial PCs and controllers.
* **Semiconductor Cooling:** Cooling for FPGAs, ASICs, and high-speed processors.
---
### 4. Part Number Breakdown
The SKU `ATS-P1-39-C2-R0` can be decoded as follows:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **P1:** Product series (maxiFLOW).
* **39:** Specific dimension/footprint code.
* **C2:** Blue Anodized finish.
* **R0:** Revision/Standard version.
- ⤷What is the recommended Thermal Interface Material (TIM) for this heat sink?
- ⤷ How do pushPIN mounting holes compare to adhesive-based mounting?
- ⤷ What are the alternatives to blue anodized finishes in terms of thermal performance?