The **ATS-P1-191-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed specifically for cooling electronic components such as CPUs, GPUs, and power modules. --- ### ## Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.90°C/W @ 200 LFM | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Interface Material** | T766 (Thermal Tape/Grease compatible) | --- ### ### Key Electronic & Structural Components #### 1. Heat Sink Body (Thermal Dissipator) The body is constructed from aluminum with a **straight-fin design**. In electronic circuits, this part acts as a passive exchanger, transferring heat generated by the semiconductor junction to the surrounding air. The blue anodized finish is not just aesthetic; it provides increased corrosion resistance and electrical insulation for the surface. #### 2. Push-Pin Attachment Mechanism Instead of using adhesive or solder, this part uses a mechanical push-pin system. * **Brass Push-Pins:** These provide a secure, vibration-resistant connection to the PCB. * **Compression Springs:** These ensure constant "Downward Pressure," which is critical for maintaining a consistent thermal interface between the chip and the heat sink, preventing air gaps that cause overheating. #### 3. Thermal Interface Material (TIM) The "R0" suffix usually denotes the specific thermal pad or interface material pre-applied to the base. This material fills the microscopic air gaps between the electronic component (like a BGA package) and the aluminum base to maximize heat flux. --- ### ### Application in Electronics This specific model is typically used in the following electronic environments: * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs where mechanical stability is required due to vibration. * **Power Electronics:** Cooling MOSFET arrays or voltage regulators that require a 45mm footprint.