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  • ATS-P1-17-C2-R0

  • AI
    ## Technical Overview of ATS-P1-17-C2-R0 The **ATS-P1-17-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling electronic integrated circuits (ICs) and surface-mount components. It belongs to the **maxiFLOW™** series manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Thermal Resistance** | 11.73°C/W (at 200 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Footprint/Size** | 54.00mm x 54.00mm | | **Height** | 12.70mm | --- ### 2. Electronic Component Breakdown The "electronic" functionality of this part is passive, focusing on heat dissipation to ensure the stability of active components like CPUs, FPGAs, or Power MOSFETs. #### A. The Fin Design (maxiFLOW™) The heatsink features a high-aspect-ratio fin design. Unlike standard extruded heatsinks, the maxiFLOW™ pattern increases the surface area significantly without adding excessive bulk. This allows for maximum air turbulence and heat transfer in forced-convection (fan-cooled) environments. #### B. The pushPIN™ Attachment System This part uses a specific mechanical attachment system: * **Compression Springs:** Provide a precise amount of "Firm Force" to ensure high-quality thermal contact between the heatsink and the chip. * **Brass Components:** The pins are usually made of brass or plastic with a stainless steel spring to prevent degradation over time. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied **T766** thermal phase-change material or grease to bridge the microscopic air gaps between the chip and the aluminum base. #### C. Thermal Performance (LFM) Electronic parts are sensitive to "junction temperature." The ATS-P1-17-C2-R0 performance varies based on airflow (Linear Feet per Minute): * **@200 LFM:** 11.73°C/W * **@500 LFM:** 3.35°C/W * **@800 LFM:** 2.30°C/W --- ### 3. Part Number Decoding The suffix **R0** indicates the revision and compliance status: * **ATS:** Advanced Thermal Solutions * **P1:** Product family * **17:** Specific size/fin configuration * **C2:** Material/Color code (Blue Anodized) * **R0:** RoHS-6 Compliant (Restriction of Hazardous Substances)
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment?
    • ⤷ Can this heatsink be used in a natural convection environment without fans?
    • ⤷ What is the specific thermal conductivity of the T766 interface material?