ATS-P1-17-C2-R0
AI

## Technical Overview of ATS-P1-17-C2-R0
The **ATS-P1-17-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling electronic integrated circuits (ICs) and surface-mount components. It belongs to the **maxiFLOW™** series manufactured by **Advanced Thermal Solutions (ATS)**.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Thermal Resistance** | 11.73°C/W (at 200 LFM) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Footprint/Size** | 54.00mm x 54.00mm |
| **Height** | 12.70mm |
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### 2. Electronic Component Breakdown
The "electronic" functionality of this part is passive, focusing on heat dissipation to ensure the stability of active components like CPUs, FPGAs, or Power MOSFETs.
#### A. The Fin Design (maxiFLOW™)
The heatsink features a high-aspect-ratio fin design. Unlike standard extruded heatsinks, the maxiFLOW™ pattern increases the surface area significantly without adding excessive bulk. This allows for maximum air turbulence and heat transfer in forced-convection (fan-cooled) environments.
#### B. The pushPIN™ Attachment System
This part uses a specific mechanical attachment system:
* **Compression Springs:** Provide a precise amount of "Firm Force" to ensure high-quality thermal contact between the heatsink and the chip.
* **Brass Components:** The pins are usually made of brass or plastic with a stainless steel spring to prevent degradation over time.
* **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied **T766** thermal phase-change material or grease to bridge the microscopic air gaps between the chip and the aluminum base.
#### C. Thermal Performance (LFM)
Electronic parts are sensitive to "junction temperature." The ATS-P1-17-C2-R0 performance varies based on airflow (Linear Feet per Minute):
* **@200 LFM:** 11.73°C/W
* **@500 LFM:** 3.35°C/W
* **@800 LFM:** 2.30°C/W
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### 3. Part Number Decoding
The suffix **R0** indicates the revision and compliance status:
* **ATS:** Advanced Thermal Solutions
* **P1:** Product family
* **17:** Specific size/fin configuration
* **C2:** Material/Color code (Blue Anodized)
* **R0:** RoHS-6 Compliant (Restriction of Hazardous Substances)
- ⤷
What are the PCB hole requirements for the pushPIN attachment?
- ⤷ Can this heatsink be used in a natural convection environment without fans?
- ⤷ What is the specific thermal conductivity of the T766 interface material?