The **ATS-P1-153-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, and high-power transistors. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Thermal Resistance** | 11.95°C/W (Unducted Flow @ 1.0 m/s) | | **Fin Type** | Straight Fin (Passive/Active) | | **Mounting Hardware** | Brass Springs and Plastic Pins | --- ### 2. Key Component Features #### A. pushPIN™ Attachment System This part utilizes a specialized mounting system that includes: * **Compression Springs:** Provide precise pressure to ensure maximum thermal contact with the component. * **Plastic/Brass Pins:** Secure the heatsink directly to the PCB via pre-drilled holes. #### B. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes pre-applied with a **Phase Change Material (PCM)** or high-performance thermal pad. This eliminates the need for manual application of thermal paste during assembly. #### C. Fin Geometry The heatsink features a low-profile design (10mm height). This makes it ideal for **1U or slim form-factor enclosures** where vertical space is limited. The blue anodized coating not only prevents corrosion but also increases thermal emissivity. --- ### 3. Application Examples This electronic part is commonly used in: * **Network Switches:** Cooling ASICs and processing units. * **Industrial PCs:** Maintaining stability in high-temperature environments. * **Embedded Systems:** For localized heat dissipation on small-board computers. ---