The **ATS-P1-151-C3-R0** is a high-performance electronic thermal management component specifically designed for cooling high-density electronic assemblies. It is part of the **pushPIN™** Heat Sink System manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications This heat sink is engineered for specific thermal resistance requirements and fits standard electronic footprints. | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-P1-151-C3-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 3.93 °C/W (@ 100 LFM) | --- ### 2. Physical Design & Construction * **Heat Sink Profile:** It features a **Straight Fin** design. This is optimized for longitudinal airflow, providing a large surface area for heat dissipation while maintaining a low pressure drop. * **Material (AL6063):** Chosen for its excellent thermal conductivity and structural integrity. * **Blue Anodized Coating:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and increases surface emissivity for better radiant heat transfer. --- ### 3. Attachment Mechanism (pushPIN™) The "P1" in the part number refers to the specific attachment kit included. This system replaces traditional adhesive tapes with a mechanical solution: 1. **Spring-Loaded Bolts:** Ensure constant pressure between the heat sink and the electronic component (CPU, GPU, or FPGA), maximizing thermal interface efficiency. 2. **Ease of Installation:** It uses a pre-drilled hole pattern on the PCB, allowing for secure mounting that is resistant to shock and vibration. --- ### 4. Thermal Performance The efficiency of this part is measured by its thermal resistance (expressed in °C/W). Lower values indicate better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 3.93 | | 300 (1.5 m/s) | 2.22 | | 500 (2.5 m/s) | 1.84 | --- ### 5. Common Applications * **Embedded Systems:** Cooling microprocessors and SOCs. * **Telecommunications:** Cooling signal processing chips in networking gear. * **Power Electronics:** Dissipating heat from MOSFETs or power regulators.