The **ATS-P1-151-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs on a Printed Circuit Board (PCB). --- ### Technical Specifications The table below outlines the core physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions** | 40mm x 40mm x 10mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 16.30°C/W (at 100 LFM) to 2.41°C/W (at 800 LFM) | | **Weight** | ~15 grams | --- ### Component Breakdown #### 1. The Heat Sink Body The body is made of **Aluminum 6063**, which provides excellent thermal conductivity while remaining lightweight. The blue anodized finish is not just for aesthetics; it increases surface emissivity and provides a layer of protection against corrosion and electrical shorts. #### 2. Mounting Mechanism (Push-Pin & Spring) Unlike adhesive-based heat sinks, the "C1" version uses a mechanical **Push-Pin** system: * **Engagement:** The pins go through pre-drilled holes in the PCB. * **Constant Pressure:** The compression springs ensure that the heat sink maintains a high-pressure contact with the chip, which is critical for minimizing thermal contact resistance. * **Reliability:** This method is preferred in high-vibration environments where thermal tape might fail. #### 3. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a pre-applied thermal interface material (like a phase-change material or thermal pad). This fills the microscopic air gaps between the component and the heat sink base. --- ### Performance Overview (LFM vs. °C/W) Performance varies based on the Linear Feet per Minute (LFM) of airflow provided by system fans: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 16.30 | | 400 | 2.0 | 4.30 | | 700 | 3.5 | 2.70 | | 800 | 4.0 | 2.41 | --- ### Applications * **Networking Equipment:** Routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators.