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  • ATS-P1-100-C2-R0

  • AI
    The **ATS-P1-100-C2-R0** is a specific electronic component primarily categorized as a **High-Performance Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their "push pin" attachment series. --- ### 1. Technical Specifications Below are the primary mechanical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Al6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 25mm | | **Attachment Type** | Push-Pin (Plastic) | | **Spring Type** | Brass | | **Thermal Resistance** | 4.84°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Components The part is engineered to dissipate heat from integrated circuits (ICs) or other PCB components. * **Fin Style:** It features a **Straight-Fin** design, which is optimized for forced air cooling (airflow from fans). * **The Push-Pin Mechanism:** This part uses a tool-free mounting system. It consists of a plastic pin and a compression spring that fits into pre-drilled holes (approx. 3mm) on the PCB, ensuring consistent pressure on the chip. * **Thermal Interface Material (TIM):** The "C2" in the part number indicates it comes with a high-performance thermal pad or grease (T766) pre-applied to the base, reducing the air gap between the heat source and the sink. --- ### 3. Part Number Breakdown The nomenclature for this series follows a specific logic: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **P1** | Push-Pin Attachment Type | | **100** | Series/Internal Revision Code | | **C2** | Thermal Interface Material (T766 pad) | | **R0** | RoHS Compliant / Revision Status | --- ### 4. Applications This heat sink is typically found in the following electronic environments: * **Networking Hardware:** Routers, switches, and bridges. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. * **Telecommunications:** Base stations and data transmission modules.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole size requirements for this specific push-pin model?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ Is there a version of this heat sink with a different fin geometry for passive cooling?