ATS-P1-100-C2-R0
AI

The **ATS-P1-100-C2-R0** is a specific electronic component primarily categorized as a **High-Performance Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their "push pin" attachment series.
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### 1. Technical Specifications
Below are the primary mechanical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Al6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 45mm x 45mm x 25mm |
| **Attachment Type** | Push-Pin (Plastic) |
| **Spring Type** | Brass |
| **Thermal Resistance** | 4.84°C/W (at 200 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Design and Components
The part is engineered to dissipate heat from integrated circuits (ICs) or other PCB components.
* **Fin Style:** It features a **Straight-Fin** design, which is optimized for forced air cooling (airflow from fans).
* **The Push-Pin Mechanism:** This part uses a tool-free mounting system. It consists of a plastic pin and a compression spring that fits into pre-drilled holes (approx. 3mm) on the PCB, ensuring consistent pressure on the chip.
* **Thermal Interface Material (TIM):** The "C2" in the part number indicates it comes with a high-performance thermal pad or grease (T766) pre-applied to the base, reducing the air gap between the heat source and the sink.
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### 3. Part Number Breakdown
The nomenclature for this series follows a specific logic:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **P1** | Push-Pin Attachment Type |
| **100** | Series/Internal Revision Code |
| **C2** | Thermal Interface Material (T766 pad) |
| **R0** | RoHS Compliant / Revision Status |
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### 4. Applications
This heat sink is typically found in the following electronic environments:
* **Networking Hardware:** Routers, switches, and bridges.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling MOSFETs or Voltage Regulators.
* **Telecommunications:** Base stations and data transmission modules.
- ⤷
What are the PCB hole size requirements for this specific push-pin model?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Is there a version of this heat sink with a different fin geometry for passive cooling?