ATS-P1-03-C2-R0
AI

The **ATS-P1-03-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed for cooling high-power semiconductors and integrated circuits.
### 1. Key Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Base Part Number** | ATS-P1-03-C2-R0 |
| **Thermal Resistance** | 4.36°C/W @ 200 LFM |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 9.50mm |
| **Fins** | Tapered Fin Design |
---
### 2. Design and Functional Components
#### A. Fin Geometry (maxiFLOW™)
The "tapered" fin design is engineered to maximize surface area while minimizing pressure drop. This allows for better airflow through the sink, which is critical in dense electronic enclosures where space is limited and air resistance is high.
#### B. The pushPIN™ Attachment System
This part uses a specific mechanical attachment called the **pushPIN™**. It includes:
* **Compression Springs:** Provides precise pressure (Force) to ensure optimal contact between the heat sink and the component.
* **Brass/Plastic Pins:** Secure the unit into pre-drilled holes on the PCB.
* **Easy Installation:** Designed for quick assembly without complex tools.
#### C. Thermal Interface Material (TIM)
The **C2** in the part number indicates that this unit comes pre-applied with **ATS-T766** thermal phase change material. This eliminates the need for manual thermal paste application, ensuring a uniform and high-conductivity thermal path from the chip to the metal.
---
### 3. Applications
This specific part is typically used for cooling the following electronic components:
* **ASICs and FPGAs:** Used in networking and telecommunications equipment.
* **CPUs/GPUs:** Found in embedded computing systems.
* **Power Modules:** For industrial power conversion.
### 4. Part Number Breakdown
* **ATS:** Advanced Thermal Solutions (Brand).
* **P1:** Part of the pushPIN™ series.
* **03:** Specific size/fin configuration code.
* **C2:** Blue Anodized finish with ATS-T766 thermal interface material.
* **R0:** Standard revision/packaging code.
---
- ⤷What is the difference between blue anodized and black anodized finishes for heat sinks?
- ⤷ How do I calculate if the 4.36°C/W thermal resistance is sufficient for my component?
- ⤷ What are the PCB hole diameter requirements for the pushPIN attachment?