The **ATS-H1-112-C1-R1** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" series, designed for cooling high-power semiconductors and electronic components. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-H1-112-C1-R1 | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | ~1.60 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 37.00mm x 41.00mm x 14.50mm | --- ### 2. Key Electronic Features #### A. Thermal Management Efficiency The "maxiFLOW" design features a flared fin structure. This geometry increases the surface area for heat dissipation while maintaining a low pressure drop, making it ideal for systems with high-speed airflow (forced convection). #### B. pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the **R1** designation indicates the use of the **pushPIN™** system. This provides: * **Constant Pressure:** Ensures the thermal interface material (TIM) is compressed evenly for maximum heat transfer. * **Secure Mounting:** Prevents the heat sink from shifting during vibration or shipping. * **Easy Installation:** Features a plastic or brass pin with a stainless steel spring. #### C. Material and Coating * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** Besides aesthetics, the anodization provides a layer of electrical insulation and increases the surface emissivity, slightly improving radiative heat transfer. --- ### 3. Common Applications This part is typically used to cool the following electronic components: 1. **CPUs and GPUs:** In embedded systems or industrial PCs. 2. **FPGAs/ASICs:** In networking equipment (routers/switches). 3. **Power Converters:** High-density DC-DC converters that generate significant localized heat. 4. **LED Drivers:** High-power lighting control modules. --- ### 4. Implementation Code Example (Thermal Calculation) If you are calculating the junction temperature ($T_j$) using this heat sink, you might use a simple Python script: ```python def calculate_junction_temp(p_watt, r_theta_sink, t_ambient, r_theta_case): # Tj = P * (R_theta_sink + R_theta_case) + T_ambient t_junction = p_watt * (r_theta_sink + r_theta_case) + t_ambient return t_junction # Example: 10W load, 1.6 C/W sink resistance, 25C ambient, 0.5 C/W case resistance tj = calculate_junction_temp(10, 1.6, 25, 0.5) print(f"Predicted Junction Temperature: {tj}°C") ```