The **ATS-61330D-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from Advanced Thermal Solutions (ATS). It is designed for cooling high-power semiconductors and integrated circuits. --- ### 1. Technical Specifications The part belongs to the **maxiFLOW™** series, which uses a unique flared fin design to maximize surface area and cooling efficiency. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-61330D-C1-R0 | | **Base Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 1.90 °C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Brass pins/Springs) | | **Dimensions (L x W x H)** | 33.0mm x 33.0mm x 9.5mm | | **Interface Material** | T766 (Pre-applied Thermal Phase Change) | --- ### 2. Key Electronic Functions While the heat sink itself is passive, its integration into an electronic system serves several critical roles: * **Thermal Dissipation:** It draws heat away from active components (like CPUs, FPGAs, or MOSFETs) to prevent thermal throttling or permanent damage. * **Thermal Interface Material (TIM):** The "C1" suffix indicates it comes with a high-performance phase-change material (T766) which bridges the microscopic air gaps between the chip and the metal surface. * **Structural Integrity:** The **pushPIN™** attachment ensures consistent pressure on the electronic package, maintaining a reliable thermal bond even under mechanical vibration. --- ### 3. Application Use Cases This specific part is typically found in: 1. **Telecommunications:** High-speed routers and networking switches. 2. **Computing:** Chipset cooling on motherboards. 3. **Power Electronics:** Cooling for DC-DC converters and voltage regulators. --- ### 4. Dimensional Code Breakdown ```text ATS - 61330D - C1 - R0 | | | | | | | └─ RoHS Compliant Version | | └────── Thermal Interface (T766 Phase Change) | └────────────── Dimensions (33mm x 33mm) └───────────────────── Advanced Thermal Solutions (Manufacturer) ```