The **ATS-55330D-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling electronic components like processors, FPGAs, and ASICs that require high thermal dissipation in tight spaces. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the component: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 33.00mm x 33.00mm x 9.50mm | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance (Unducted)** | 6.40° C/W @ 200 LFM | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. maxiFLOW™ Fin Design The heat sink features a tapered fin geometry. This design increases the surface area while reducing pressure drop, allowing air to flow more effectively through the fins. In electronics, this is critical for maintaining low junction temperatures in high-density PCB layouts. #### B. maxiGRIP™ Attachment System Instead of using permanent adhesives or drilling holes into the PCB for "push-pins," this part uses a **plastic frame clip** and a **stainless steel spring clip**. * **Mechanical Security:** Provides high-pressure contact with the component to ensure efficient heat transfer. * **Reusability:** Allows the heat sink to be detached and reattached without damaging the chip or the board. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * This material fills the microscopic air gaps between the component die and the heat sink base. * It ensures a low-resistance thermal path, which is essential for components dissipating significant wattage. --- ### 3. Application Use Cases The ATS-55330D-C2-R0 is typically used in the following electronic environments: 1. **Telecommunications:** Cooling network switches and routers. 2. **Embedded Systems:** Industrial PCs where vertical space (9.5mm height) is limited. 3. **Power Electronics:** Managing heat for DC-DC converters or motor drivers. ---