The **ATS-55270R-C1-R0** is a high-performance heat sink component part of the **maxiFLOW™** series manufactured by Advanced Thermal Solutions (ATS). This specific part is designed for cooling electronic components, primarily BGA (Ball Grid Array) packages. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum | | **Finish** | Black Anodized | | **Attachment Method** | thermal-interface material (TIM) / Clip On | | **Dimensions (L x W x H)** | 27.00mm x 27.00mm x 19.50mm | | **Thermal Resistance** | 3.50°C/W @ 200 LFM | --- ### 2. Key Electronic Features The ATS-55270R-C1-R0 is engineered with specific electronic and mechanical considerations: * **maxiFLOW™ Design:** It features a tapered fin structure which maximizes surface area for convection cooling while minimizing pressure drop. This is crucial for high-density electronic enclosures. * **thermal-interface material (TIM):** The "R0" designation typically implies the inclusion of a pre-applied thermal tape or interface (like Saint-Gobain C700), which ensures efficient heat transfer from the chip to the aluminum fins. * **BGA Compatibility:** Sized at 27mm x 27mm, it is specifically tailored for standard BGA integrated circuits, such as FPGAs, processors, and ASICs. --- ### 3. Application Use Cases 1. **Telecommunications:** Used in routers and switches where airflow is consistent but space is limited. 2. **Embedded Systems:** Cooling industrial PCs and processing units. 3. **Power Supplies:** Managing heat for high-output voltage regulators. --- ### 4. Thermal Performance Comparison Below is an approximation of how the thermal resistance (Rth) changes based on airflow: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 3.5 | | 400 (2.0 m/s) | 2.4 | | 600 (3.0 m/s) | 1.9 |