The **ATS-52375P-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, which is specifically designed to provide superior cooling for electronic components in environments with constrained airflow. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-52375P-C2-R0 | | **Product Series** | maxiFLOW™ | | **Attachment Method** | superGRIP™ (Plastic Clip) | | **Material** | Anodized Aluminum (Blue) | | **Thermal Resistance** | 2.50°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 37.5mm x 37.5mm x 22.86mm | | **Thermal Interface Material (TIM)** | pre-applied Saint-Gobain C8000 | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Geometry (maxiFLOW™) The "maxiFLOW" design features a flared fin structure. This geometry is engineered to: * **Increase Surface Area:** More surface area allows for better heat dissipation into the surrounding air. * **Reduce Pressure Drop:** The spacing and angle of the fins allow air to flow through the sink more easily, which is critical for systems with low-power fans. #### 2. Attachment System (superGRIP™) The **C2** in the part number refers to the specific attachment style. The superGRIP™ system is a mechanical mounting solution that: * Requires no holes in the Printed Circuit Board (PCB). * Uses a plastic frame (clip) that snaps onto the base of the electronic component (like a BGA or FPGA). * Provides consistent pressure to ensure the thermal interface material works efficiently. #### 3. Thermal Interface Material (TIM) The **R0** suffix indicates the specific TIM provided. This part comes with **Saint-Gobain C8000** pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink and the electronic chip. * **Phase Change:** This material offers high thermal conductivity and reliability over the lifetime of the electronic device. --- ### Typical Applications This specific heat sink is commonly used for cooling high-heat-density electronic components such as: * **ASICs and FPGAs:** Used in networking and telecommunications. * **Processors:** Embedded CPUs in industrial computing. * **Video Graphic Chips:** High-end image processing units. ---