ATS-21F-75-C2-R0
AI

The **ATS-21F-75-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed to optimize airflow and cooling for electronic components.
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### 1. Technical Specifications
The part number encodes specific physical and thermal characteristics:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height (H)** | 25mm |
| **Thermal Resistance** | 1.70°C/W (at 200 LFM) |
| **Airflow Pattern** | Directional (High Performance) |
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### 2. Key Design Features
* **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that increases the surface area for heat dissipation while reducing the pressure drop, allowing air to move more efficiently through the fins.
* **pushPIN™ Attachment:** This model uses a specialized attachment system consisting of a brass pin and a stainless steel spring. This ensures even pressure across the component (like a CPU or FPGA) for optimal thermal contact.
* **Thermal Interface Material (TIM):** Typically, these come pre-applied with **T766** (a high-performance thermal phase-change material) or similar, ensuring there are no air gaps between the heat sink and the chip.
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### 3. Common Applications
This specific part is used in environments where heat-sensitive electronic components are densely packed, such as:
1. **Telecommunications:** Network switches and high-speed routers.
2. **Data Centers:** Cooling high-end processors or ASICs.
3. **Industrial Controls:** Power supplies and motor controllers that generate significant localized heat.
4. **Embedded Systems:** High-performance single-board computers.
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### 4. Comparison Table: Thermal Resistance vs. Airflow
The efficiency of the ATS-21F-75-C2-R0 scales with the velocity of the air provided by system fans:
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 (1.0 m/s) | 1.70 |
| 300 (1.5 m/s) | 1.35 |
| 400 (2.0 m/s) | 1.14 |
| 500 (2.5 m/s) | 1.01 |
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What is the difference between blue anodized and black anodized heat sinks?
- ⤷ How do I calculate the required LFM for my specific electronic component?
- ⤷ What are the PCB hole requirements for the pushPIN™ attachment system?