The **ATS-21F-72-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Category** | Thermal Management - Heat Sinks | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | ~5.11°C/W (at 100 LFM) | --- ### 2. Physical Dimensions The "72" in the part number corresponds to specific dimensional scaling within the ATS pushPIN™ series. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height (Fin Depth):** 25.00 mm * **Hole Pattern:** 38.00 mm (Square) --- ### 3. Design Characteristics #### Fin Profile: Straight Fin This model uses a **Straight Fin** design. This is ideal for systems where there is a consistent, directed airflow (forced convection). Straight fins provide a lower pressure drop compared to cross-cut designs, allowing air to flow through the heat sink more efficiently. #### Attachment System: pushPIN™ The "R0" designation typically refers to the mounting kit. The pushPIN™ system ensures: 1. **Uniform Pressure:** The spring-loaded mechanism provides consistent contact pressure between the heat sink and the component. 2. **Ease of Assembly:** It allows for quick installation using pre-drilled holes on the PCB. 3. **Interface Material:** These usually come with a **Thermal Interface Material (TIM)** pre-applied to the base (often a T766 phase-change material) to fill microscopic air gaps. --- ### 4. Component Material & Finish * **Aluminum 6063:** Provides a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves emissivity for radiant heat transfer. --- ### 5. Application Use Cases The ATS-21F-72-C2-R0 is commonly used in: * **Telecommunications:** Cooling of high-speed network switches. * **Industrial PC:** Thermal management for embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs and IGBTs.