The **ATS-21B-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" series designed for securing the cooler directly to a Printed Circuit Board (PCB). --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 30mm | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 6.69°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | Straight (High-Flow Design) | | **RoHS Status** | Compliant | --- ## 2. Key Components & Construction ### A. The Heat Sink Body The main body is made of extruded aluminum. The **30mm height** and **40mm square base** are designed to provide a large surface area for heat dissipation from integrated circuits (ICs), such as CPUs, GPUs, or FPGAs. ### B. The Push-Pin Attachment Instead of using messy thermal adhesives or tapes, this model uses a mechanical push-pin system: * **Brass/Plastic Pins:** Provide a secure mechanical fit to the PCB. * **Compression Springs:** Ensure constant pressure between the heat sink base and the electronic component, which is critical for efficient heat transfer. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **T766 thermal phase-change material**. This eliminates the need for manual application of thermal paste. --- ## 3. Performance Data (Airflow) Thermal performance is highly dependent on the velocity of air (measured in Linear Feet per Minute - LFM) moving through the fins. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 6.69 | | 300 | 4.81 | | 400 | 3.90 | | 500 | 3.34 | | 600 | 2.98 | --- ## 4. Typical Applications This part is commonly used in industrial and high-reliability electronics where vibration resistance and reliable cooling are required: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and high-speed processing units.