ATS-20H-151-C2-R0
AI

The **ATS-20H-151-C2-R0** is a specific electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their high-performance "superGRIP" series of heat sinks.
### 1. Component Overview
This part is a high-performance heat sink designed for cooling surface-mount electronic components, such as BGA (Ball Grid Array) packages, CPUs, or GPUs, where space is limited but thermal loads are high.
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### 2. Technical Specifications
The following table outlines the physical and thermal characteristics of the ATS-20H-151-C2-R0:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | superGRIP (Clip-on) |
| **Dimensions (L x W x H)** | 35mm x 35mm x 10mm |
| **Fin Style** | Straight (High-density) |
| **Thermal Resistance** | ~9.48°C/W (at 200 LFM) |
| **Mounting Hardware** | Included (Spring-loaded clip) |
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### 3. Key Electronic Functions & Features
#### A. Thermal Dissipation
The primary function is to increase the surface area of an electronic component to facilitate heat transfer to the surrounding air. The **C2** in the part number indicates the use of **Aluminum** with a specific blue anodized finish, which provides durability and minor emissivity benefits.
#### B. superGRIP™ Attachment Technology
Unlike traditional heat sinks that require holes in the PCB, this part uses a mechanical clip system:
* **Plastic Frame Clip:** Snaps around the electronic component.
* **Metal Spring Clip:** Provides high pressure to ensure the thermal interface material (TIM) is compressed for maximum heat transfer.
* **Safety:** It prevents the heat sink from shifting during vibration or shock, protecting the solder joints of the BGA package.
#### C. Airflow Optimization
The straight-fin design is optimized for environments with consistent airflow (forced convection). The low profile (10mm) makes it ideal for 1U or 2U rack-mounted servers where vertical space is restricted.
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying its properties:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **20H:** Specific series/profile designation.
* **151:** Dimensional code (35mm x 35mm).
* **C2:** Material/Finish (Aluminum, Blue Anodized).
* **R0:** Revision or RoHS compliance status.
- ⤷
What is the thermal resistance of this heat sink at higher airflow speeds (e.g.
- ⤷ 400 LFM)?
- ⤷ How does the superGRIP attachment method compare to thermal adhesive tape?
- ⤷ Is a thermal interface material (TIM) pre-applied to this specific part number?