The **ATS-20G-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number defines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Base Dimensions** | 45mm x 45mm | | **Height** | 10mm (Low Profile) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.67° C/W (@ 1.0 m/s) | | **Weight** | ~28.5 grams | --- ### 2. Key Components & Design #### A. Fin Pattern (Straight Fin) The "G" in the part number signifies a **Straight Fin** geometry. This design is optimized for environments where there is a consistent, unidirectional airflow. The fins increase the surface area to dissipate heat from the component into the surrounding air. #### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, this part uses a precision-engineered spring-loaded mechanism: - **Push Pins:** Usually made of brass or plastic, they provide a secure fit. - **Compression Springs:** Ensure a consistent "Down Force" of roughly 20 Newtons, which optimizes the thermal interface material (TIM) performance. #### C. Thermal Interface Material (TIM) The "C2" suffix indicates that the heat sink comes pre-applied with **ATS-PPS-02** thermal grease (or equivalent). This fills microscopic air gaps between the heat sink and the electronic chip to ensure maximum heat transfer. --- ### 3. Electronic Application This specific model is commonly used for cooling: * **FPGAs & ASICs:** High-speed processors that generate localized heat. * **CPUs/GPUs:** In embedded systems where vertical clearance is limited (only 10mm high). * **Power Modules:** High-density power supplies requiring active or passive cooling. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow Velocity (m/s) | 1.0 (200 LFM) | 2.0 (400 LFM) | 3.0 (600 LFM) | | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 6.67 | 2.80 | 1.81 | ---