The **ATS-20F-98-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and electronic application. ### 1. General Specifications This part is manufactured by **Advanced Thermal Solutions (ATS)** as part of their "pushPIN™" heat sink assembly line. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-20F-98-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 15.31°C/W (at 100 LFM) | --- ### 2. Mechanical Dimensions Understanding the physical footprint is critical for PCB (Printed Circuit Board) layout design. | Dimension | Value | | :--- | :--- | | **Length / Width** | 45.00 mm x 45.00 mm | | **Height** | 15.00 mm | | **Hole Spacing** | 38.00 mm | | **Fin Pitch** | Fine | | **Fin Pattern** | Cross-Cut | --- ### 3. Key Electronic Cooling Features * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. T766 is a high-performance phase-change material that ensures minimal thermal resistance between the electronic chip (CPU, GPU, or FPGA) and the heatsink base. * **PushPIN™ Technology:** The "pushPIN" assembly uses a flexible attachment mechanism. This is vital for electronic parts as it provides a precise "compression force" to ensure the heatsink stays in contact with the chip without cracking the silicon die or damaging the PCB. * **Cross-Cut Fin Design:** The fins are cut in both horizontal and vertical directions. This is highly efficient for electronics in "omnidirectional" airflow environments, meaning it cools effectively regardless of which direction the fan is blowing. * **Aluminum Construction:** Chosen for its high thermal conductivity and light weight, preventing mechanical stress on the PCB solder joints. --- ### 4. Typical Applications The ATS-20F-98-C2-R0 is commonly used to cool: 1. **High-speed Processors:** For industrial computing. 2. **FPGA/ASIC:** High-density programmable logic devices that generate significant heat. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators. 4. **Networking Equipment:** Routers and switches with high data throughput requirements. ---