The **ATS-20F-97-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The part number follows a specific naming convention that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | push-PIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 20.30° C/W @ 100 LFM | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Fin Design This model uses a **straight-fin** or **cross-cut** design. This maximizes the surface area available for convective heat transfer. Because it is only 10mm high, it is considered a "low profile" heat sink, ideal for tight enclosures or 1U server racks. #### B. Push-Pin Mounting System The `20F` designation refers to the specific push-pin attachment. This is a mechanical mounting system that: * Uses a spring-loaded plastic or brass pin to secure the heat sink to the PCB. * Ensures consistent pressure across the component surface for optimal thermal contact. * Requires pre-drilled holes in the PCB (typically 3.0mm diameter). #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Purpose:** Fills microscopic air gaps between the electronic component and the heat sink. * **Conductivity:** High-performance phase-change material that ensures efficient heat transfer. --- ### 3. Thermal Performance Comparison The performance of the ATS-20F-97-C2-R0 varies based on the airflow (measured in Linear Feet per Minute - LFM) within the electronic system: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 20.30 | | 300 | 1.5 | 6.70 | | 500 | 2.5 | 4.40 | | 700 | 3.5 | 3.50 | --- ### 4. Typical Applications * **FPGA & ASIC Cooling:** Cooling large integrated circuits in networking gear. * **Power Supplies:** Managing heat in DC-DC converters. * **Embedded Systems:** Used in industrial PCs where space is limited but cooling is critical.