The **ATS-20F-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance (Unducted)** | 5.63 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.22 °C/W @ 100 LFM | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits within the PCB layout and does not interfere with neighboring components. * **Length (A):** 40.00 mm * **Width (B):** 40.00 mm * **Height (C):** 35.00 mm * **Fin Pitch:** Fine-Pitch * **Fin Pattern:** XCUT (Cross-cut) --- ### 3. Key Electronic/Mechanical Features ### A. XCUT Fin Design The heat sink features an **XCUT** pattern. This means the fins are cut in a cross-directional manner, which increases the surface area and allows for multi-directional airflow. This is ideal for electronic enclosures where the direction of the cooling fan's air may not be perfectly linear. ### B. pushPIN™ Attachment Instead of using messy thermal adhesives or tapes, this part uses the **pushPIN™** system. - It utilizes a pre-drilled hole pattern on the PCB. - It includes a **stainless steel spring** that provides precise pressure (7-10 lbs) to ensure the heat sink makes optimal contact with the electronic chip. ### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates that it comes with a **pre-applied thermal interface material** (usually T412 or similar). This ensures high conductivity between the component and the aluminum base without requiring manual application of thermal paste. --- ### 4. Application Use-Cases * **High-Density Power Supplies:** Dissipating heat from MOSFETs. * **Embedded Systems:** Cooling processors in compact industrial PCs. * **Telecommunications:** Used on PCB boards within network switches and routers.