The **ATS-20F-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "maxiFLOW" product series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs through convection. --- ### 1. Technical Specifications The part number encodes specific mechanical and thermal properties. Here is a breakdown of its characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Thermal Resistance** | 1.33° C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Pressure Spring** | Brass / Steel (Nickel Plated) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Features The **ATS-20F-95-C2-R0** utilizes several specialized design elements to optimize cooling efficiency in tight spaces: * **maxiFLOW™ Geometry:** The fin structure features a flared design that increases the surface area for maximum heat dissipation while maintaining a low pressure drop. * **pushPIN™ Attachment:** Instead of messy adhesives, this part uses a mechanical push-pin system with a compression spring. This ensures consistent pressure across the component for better heat transfer and allows for secure mounting. * **Material Selection:** The aluminum body is lightweight and offers high thermal conductivity, while the blue anodized finish provides corrosion resistance and increased emissivity. --- ### 3. Application Use Cases This heat sink is typically found in hardware environments where airflow is directed through the chassis. Common applications include: 1. **Networking Hardware:** Switches, routers, and high-speed gateways. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Supplies:** Cooling voltage regulators or power transistors. 4. **Telecom Equipment:** Radio units and signal processing boards. --- ### 4. Thermal Performance Comparison The effectiveness of this heat sink depends heavily on the Air Velocity (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Ductless) | 1.80 | | 200 (Ductless) | 1.33 | | 400 (Ductless) | 1.10 | | 600 (Ductless) | 0.95 |