The **ATS-20F-89-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic devices like CPUs, GPUs, FPGAs, and power modules. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its dimensions and material properties. | Specification | Value / Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Family** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 20.00 mm | | **Thermal Resistance** | 7.94 °C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Interface Material** | T766 (Thermal Grease/Phase Change) | --- ## 2. Key Electronic Features ### A. Thermal Performance The "89" in the part number signifies a specific fin pattern and density. This heat sink uses a **straight fin** or **cross-cut** design to maximize surface area. The thermal resistance value indicates how efficiently it moves heat away from the semiconductor junction to the surrounding air. ### B. Push-Pin Attachment System Unlike adhesive-based heat sinks, the `-R0` series uses a mechanical push-pin system. * **Spring-Loaded:** Provides consistent pressure (clamping force) to ensure the thermal interface material (TIM) performs optimally. * **Reliability:** Resistant to vibration and mechanical shock, making it suitable for industrial and networking hardware. ### C. Blue Anodized Finish The blue anodization is not just for aesthetics; it provides: * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Increased Emissivity:** Improves radiant heat transfer compared to bare aluminum. --- ## 3. Applications This component is typically found in the following electronic environments: 1. **Telecommunications:** Cooling signal processors in routers and switches. 2. **Embedded Systems:** Small form factor motherboards where vertical space (20mm) is limited. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ## 4. Mechanical Drawing Reference If you are designing a PCB for this part, note the hole pattern requirement: ```text 35.00 mm <--------------> ________________ ^ | (Hole) | | | | | 35.00 mm | [CHIP] | | | (Hole) | | |________________| v ``` *Note: The pitch between holes is typically 40.00mm diagonal for this specific footprint.*