The **ATS-20F-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number provides specific data regarding its dimensions, thermal resistance, and material properties. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Attachment Type** | Push-pin | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 25mm x 25mm | | **Height** | 30.00mm | | **Thermal Resistance** | 2.63°C/W (Unducted @ 100 LFM) | | **Fin Pattern** | Straight Fin | --- ### 2. Key Electronic Features #### A. Attachment Mechanism (pushPIN™) The part utilizes a flexible push-pin system. This is critical for electronics because: * **Constant Pressure:** It ensures the heat sink remains in firm contact with the electronic chip, maintaining a low thermal interface resistance. * **Durability:** The springs are pre-drilled to provide precise force, preventing damage to the PCB (Printed Circuit Board) during installation. #### B. Thermal Performance Thermal resistance is measured in **°C/W** (degrees Celsius per Watt). A rating of **2.63°C/W** means that for every watt of power the electronic component consumes, its temperature will rise 2.63°C above the ambient air temperature (at 100 LFM airflow). #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides increased corrosion resistance and slight electrical insulation to prevent accidental shorts if the sink touches nearby exposed components. --- ### 3. Typical Applications This specific size (25mm x 25mm) is commonly used for: 1. **Network Switches & Routers:** Cooling ASICs and high-speed processors. 2. **Power Supplies:** Managing heat in DC-DC converters. 3. **Industrial PCs:** Cooling embedded systems where space is limited but vertical height (30mm) is available. --- ### 4. Comparison of Airflow Performance The efficiency of this part changes significantly based on the airflow provided by system fans: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.63 | | 300 (1.5 m/s) | 1.58 | | 500 (2.5 m/s) | 1.28 |