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  • ATS-20F-77-C2-R0

  • AI
    ## Electronic Parts Analysis: ATS-20F-77-C2-R0 The part number **ATS-20F-77-C2-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Thermal Resistance** | 9.30°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Dimensions and Geometry The "77" in the part number indicates the specific size configuration within the series. * **Length/Width:** 25.00 mm x 25.00 mm * **Height:** 20.00 mm (measured from the base) * **Pitch (Fin Spacing):** 1.40 mm * **Mounting Hole Distance:** 30.00 mm (Center to Center) --- ### 3. Component Breakdown The heat sink assembly consists of several distinct electronic cooling parts: 1. **Heat Sink Body:** A square, cross-cut fin design. The cross-cut architecture allows for airflow from any direction, making it ideal for high-density PCBs. 2. **Push Pins:** These are the mechanical fasteners (usually brass or plastic) that secure the sink to the PCB through pre-drilled holes. 3. **Compression Springs:** These sit on the push pins to provide consistent "Down Force," ensuring the heat sink maintains firm contact with the electronic chip. 4. **TIM (Thermal Interface Material):** The **T766** material is pre-applied to the bottom surface. This fills microscopic air gaps between the chip surface and the aluminum to maximize heat transfer. --- ### 4. Part Number Decoder Understanding the nomenclature helps in identifying variations: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions | | **20** | Push-pin size/series | | **F** | Fine Pitch (Fin density) | | **77** | Dimensional code (25x25x20 mm) | | **C2** | Thermal Performance Grade / Material | | **R0** | RoHS Compliant version | ---
    ✨ Follow-up Questions
    • ⤷ What are the benefits of the blue anodized finish on this heat sink?
    • ⤷ Is the T766 thermal interface material suitable for high-power processors?
    • ⤷ What is the recommended hole size on the PCB for the ATS-20F push pins?