ATS-20F-77-C2-R0
AI

## Electronic Parts Analysis: ATS-20F-77-C2-R0
The part number **ATS-20F-77-C2-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and FPGAs.
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### 1. Technical Specifications
The following table summarizes the physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Brass) |
| **Thermal Resistance** | 9.30°C/W (Unducted Flow @ 100 LFM) |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Dimensions and Geometry
The "77" in the part number indicates the specific size configuration within the series.
* **Length/Width:** 25.00 mm x 25.00 mm
* **Height:** 20.00 mm (measured from the base)
* **Pitch (Fin Spacing):** 1.40 mm
* **Mounting Hole Distance:** 30.00 mm (Center to Center)
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### 3. Component Breakdown
The heat sink assembly consists of several distinct electronic cooling parts:
1. **Heat Sink Body:** A square, cross-cut fin design. The cross-cut architecture allows for airflow from any direction, making it ideal for high-density PCBs.
2. **Push Pins:** These are the mechanical fasteners (usually brass or plastic) that secure the sink to the PCB through pre-drilled holes.
3. **Compression Springs:** These sit on the push pins to provide consistent "Down Force," ensuring the heat sink maintains firm contact with the electronic chip.
4. **TIM (Thermal Interface Material):** The **T766** material is pre-applied to the bottom surface. This fills microscopic air gaps between the chip surface and the aluminum to maximize heat transfer.
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### 4. Part Number Decoder
Understanding the nomenclature helps in identifying variations:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions |
| **20** | Push-pin size/series |
| **F** | Fine Pitch (Fin density) |
| **77** | Dimensional code (25x25x20 mm) |
| **C2** | Thermal Performance Grade / Material |
| **R0** | RoHS Compliant version |
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- ⤷
What are the benefits of the blue anodized finish on this heat sink?
- ⤷ Is the T766 thermal interface material suitable for high-power processors?
- ⤷ What is the recommended hole size on the PCB for the ATS-20F push pins?