The **ATS-20F-72-C3-R0** is a high-performance electronic thermal management component, specifically a **push-pin style heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs) such as CPUs, GPUs, or high-power transistors. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Series** | blueICE™ | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (H)** | 25mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 5.19°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### Component Breakdown #### 1. Heat Sink Body (Straight Fin) The core of the part is an aluminum block with vertical fins. The **Straight Fin** design is optimized for environments with high-velocity airflow (forced convection), allowing air to flow smoothly through the channels to strip heat away from the surface. #### 2. Push-Pin Attachment Instead of using messy adhesives or thermal tape, this part uses a mechanical **Push-Pin** system. * **Mechanism:** Two plastic pins with internal springs. * **Benefit:** Provides consistent downward pressure on the chip, ensuring a tight thermal bond while allowing for easy installation and removal without damaging the PCB. #### 3. Thermal Interface Material (TIM) The bottom of the heat sink comes pre-applied with **T766**. * **Purpose:** This material fills the microscopic air gaps between the chip and the heat sink base. * **Conductivity:** It is a high-performance phase-change material designed to minimize thermal resistance. #### 4. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** The blue coating isn't just aesthetic; anodizing increases the surface emissivity, slightly improving heat radiation and protecting the aluminum from corrosion. --- ### Typical Applications * **Telecommunications:** Cooling networking switches and routers. * **Computing:** Heat dissipation for chipsets on motherboards. * **Embedded Systems:** Industrial PCs where mechanical vibration resistance is required (provided by the push-pin clips).