ATS-20F-64-C2-R0
AI

The **ATS-20F-64-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in electronic assemblies.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Heat Sink Type** | Fine-Pitch (Rectangular) |
| **Material** | Aluminum (AL6063) |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 25mm |
| **Thermal Resistance** | 9.39°C/W (at 100 LFM) |
| **Surface Finish** | Blue Anodized |
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### 2. Electronic/Physical Composition
While not an "active" electronic part (like an IC), it is a critical "passive" mechanical-electronic component. Its design includes:
* **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** phase-change material to ensure maximum heat transfer from the semiconductor to the aluminum.
* **Fin Design:** It features a **Straight-Fin** or **Cross-Cut** pattern (depending on the specific sub-variant) designed to optimize airflow from cooling fans.
* **Spring-Loaded Attachment:** The "push-pin" mechanism uses a compression spring to provide a specific amount of "downward force" (pressure), ensuring the heat sink stays in contact with the CPU/GPU despite vibrations or thermal expansion.
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### 3. Application Use Cases
This component is typically used to cool the following electronic parts:
1. **Microprocessors (CPUs):** Low-to-medium power embedded processors.
2. **FPGAs/ASICs:** High-density logic chips that generate localized heat.
3. **Power Converters:** Voltage regulators and power modules that require surface-area cooling.
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### 4. Part Number Breakdown
```text
ATS - 20 - F - 64 - C2 - R0
| | | | | |
| | | | | Revision/Packaging Code
| | | | Color/Finish (C2 = Blue Anodized)
| | | Sequence/Size Code
| | Fin Pitch (F = Fine)
| Series Number
Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What is the significance of the C2 finish in thermal management?
- ⤷ How do I calculate the correct push-pin length for a specific PCB thickness?
- ⤷ What are the alternatives to push-pin mounting for this heat sink size?