The **ATS-20F-60-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW" series, designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-20F-60-C2-R0 | | **Type** | Board Level Heat Sink | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 9.06°C/W (Unducted Flow @ 1.0 m/s) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | --- ### 2. Key Design Elements #### A. The maxiFLOW™ Geometry The heat sink features a unique **flared fin structure**. Unlike traditional straight-fin heat sinks, the flared fins increase the surface area while reducing pressure drop. This allows for maximum cooling performance in environments with restricted airflow. #### B. pushPIN™ Attachment System This model uses the **pushPIN™** mounting mechanism, which offers several advantages: * **Ease of Assembly:** It consists of a flexible spring-loaded pin that snaps into pre-drilled holes on the PCB. * **Consistent Pressure:** Ensures the thermal interface material (TIM) is evenly distributed between the heat sink and the component. * **Reliability:** Provides secure attachment that can withstand high-vibration environments. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface material pre-applied to the base. * **T766:** A high-performance thermal phase-change material or grease is typically pre-applied to ensure immediate, efficient heat transfer out of the box. --- ### 3. Thermal Performance Comparison Thermal resistance ($R_{th}$) determines how effectively the part moves heat away from the silicon. Lower values are better. | Air Velocity (m/s) | Thermal Resistance (°C/W) - Unducted | | :--- | :--- | | 1.0 (200 LFM) | 9.06 | | 2.0 (400 LFM) | 4.80 | | 3.0 (600 LFM) | 3.50 | --- ### 4. Applications The ATS-20F-60-C2-R0 is commonly used in: * **Network Switches/Routers:** Where high-density components generate significant heat. * **Embedded Systems:** Industrial PCs where space is limited but cooling is critical. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators.